Alliance Memory, Inc.
Изображение может быть репрезентативным.
Подробную информацию о продукте см. в характеристиках.
AS4C128M8D3B-12BIN
Посмотреть детали Таблицы данных

AS4C128M8D3B-12BIN

Product Overview

Category

AS4C128M8D3B-12BIN belongs to the category of dynamic random-access memory (DRAM) modules.

Use

It is primarily used as a memory component in various electronic devices such as computers, servers, and embedded systems.

Characteristics

  • Type: DRAM module
  • Capacity: 1 Gigabit (128 Megabytes)
  • Organization: 128M words x 8 bits x 8 banks
  • Speed: 12ns (nanoseconds)
  • Voltage: 3.3V
  • Package: BGA (Ball Grid Array)
  • Interface: Synchronous

Packaging/Quantity

AS4C128M8D3B-12BIN is typically packaged in trays or reels. The quantity per package may vary depending on the manufacturer's specifications.

Specifications

  • Operating Temperature Range: -40°C to +85°C
  • Refresh Mode: Auto-refresh and self-refresh
  • Burst Length: 1, 2, 4, 8, full page
  • CAS Latency: 3
  • Data Rate: 83.33 MT/s (Megatransfers per second)
  • Power Supply: VDD = 3.135V to 3.465V, VDDQ = 3.135V to 3.465V

Detailed Pin Configuration

The AS4C128M8D3B-12BIN module has a total of 78 pins. The pin configuration is as follows:

  1. VSS (Ground)
  2. DQ0 (Data Input/Output 0)
  3. DQ1 (Data Input/Output 1)
  4. DQ2 (Data Input/Output 2)
  5. DQ3 (Data Input/Output 3)
  6. DQ4 (Data Input/Output 4)
  7. DQ5 (Data Input/Output 5)
  8. DQ6 (Data Input/Output 6)
  9. DQ7 (Data Input/Output 7)
  10. VDDQ (Power Supply for Data I/O Buffers)
  11. VSS (Ground)
  12. DQ8 (Data Input/Output 8)
  13. DQ9 (Data Input/Output 9)
  14. DQ10 (Data Input/Output 10)
  15. DQ11 (Data Input/Output 11)
  16. DQ12 (Data Input/Output 12)
  17. DQ13 (Data Input/Output 13)
  18. DQ14 (Data Input/Output 14)
  19. DQ15 (Data Input/Output 15)
  20. VDDQ (Power Supply for Data I/O Buffers)
  21. VSS (Ground)
  22. DQ16 (Data Input/Output 16)
  23. DQ17 (Data Input/Output 17)
  24. DQ18 (Data Input/Output 18)
  25. DQ19 (Data Input/Output 19)
  26. DQ20 (Data Input/Output 20)
  27. DQ21 (Data Input/Output 21)
  28. DQ22 (Data Input/Output 22)
  29. DQ23 (Data Input/Output 23)
  30. VDDQ (Power Supply for Data I/O Buffers)
  31. VSS (Ground)
  32. DQ24 (Data Input/Output 24)
  33. DQ25 (Data Input/Output 25)
  34. DQ26 (Data Input/Output 26)
  35. DQ27 (Data Input/Output 27)
  36. DQ28 (Data Input/Output 28)
  37. DQ29 (Data Input/Output 29)
  38. DQ30 (Data Input/Output 30)
  39. DQ31 (Data Input/Output 31)
  40. VDDQ (Power Supply for Data I/O Buffers)
  41. VSS (Ground)
  42. A0 (Address Input 0)
  43. A1 (Address Input 1)
  44. A2 (Address Input 2)
  45. A3 (Address Input 3)
  46. A4 (Address Input 4)
  47. A5 (Address Input 5)
  48. A6 (Address Input 6)
  49. A7 (Address Input 7)
  50. VDD (Power Supply)
  51. VSS (Ground)
  52. A8 (Address Input 8)
  53. A9 (Address Input 9)
  54. A10 (Address Input 10)
  55. A11 (Address Input 11)
  56. A12 (Address Input 12)
  57. A13 (Address Input 13)
  58. A14 (Address Input 14) 59

Перечислите 10 распространенных вопросов и ответов, связанных с применением AS4C128M8D3B-12BIN в технических решениях.

  1. Question: What is the capacity of the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module has a capacity of 128 megabits (Mb).

  2. Question: What is the data rate of the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module operates at a data rate of 12 nanoseconds (ns).

  3. Question: What is the organization of the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module has an organization of 128 megabits organized as 8 banks of 16 megabits each.

  4. Question: What is the voltage requirement for the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module requires a voltage of 3.3 volts (V) for operation.

  5. Question: What is the operating temperature range for the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module can operate within a temperature range of -40 to +85 degrees Celsius.

  6. Question: Does the AS4C128M8D3B-12BIN memory module support ECC (Error Correction Code)?
    Answer: No, the AS4C128M8D3B-12BIN memory module does not support ECC.

  7. Question: Can the AS4C128M8D3B-12BIN memory module be used in both commercial and industrial applications?
    Answer: Yes, the AS4C128M8D3B-12BIN memory module is suitable for both commercial and industrial applications.

  8. Question: What is the package type of the AS4C128M8D3B-12BIN memory module?
    Answer: The AS4C128M8D3B-12BIN memory module comes in a 60-ball FBGA (Fine-Pitch Ball Grid Array) package.

  9. Question: Is the AS4C128M8D3B-12BIN memory module compatible with DDR3 memory controllers?
    Answer: Yes, the AS4C128M8D3B-12BIN memory module is designed to be compatible with DDR3 memory controllers.

  10. Question: Can the AS4C128M8D3B-12BIN memory module be used in laptops or desktop computers?
    Answer: Yes, the AS4C128M8D3B-12BIN memory module can be used in both laptops and desktop computers that support DDR3 memory.