Alliance Memory, Inc.
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AS4C64M16D3LA-12BINTR
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AS4C64M16D3LA-12BINTR

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory module
  • Characteristics:
    • High-speed and high-density memory
    • Low power consumption
    • Wide operating temperature range
  • Package: BGA (Ball Grid Array)
  • Essence: Dynamic Random Access Memory (DRAM)
  • Packaging/Quantity: Tray, 250 units per tray

Specifications

  • Part Number: AS4C64M16D3LA-12BINTR
  • Organization: 64M words x 16 bits x 4 banks
  • Voltage Supply: 1.35V to 1.5V
  • Speed Grade: DDR3L-1600 (PC3L-12800)
  • Operating Temperature Range: -40°C to +85°C
  • Refresh Mode: Auto-refresh and self-refresh
  • Interface: Double Data Rate (DDR) Synchronous DRAM
  • Pin Count: 96-ball FBGA

Detailed Pin Configuration

The AS4C64M16D3LA-12BINTR has a total of 96 pins arranged in a specific configuration. The pinout diagram is as follows:

Pin Configuration Diagram

Functional Features

  • High-speed data transfer rate
  • Large storage capacity
  • Low power consumption
  • Automatic refresh mechanism
  • Error correction capabilities
  • On-die termination for improved signal integrity

Advantages

  • Fast data access and transfer speeds
  • Suitable for high-performance computing applications
  • Low power consumption extends battery life in portable devices
  • Reliable error correction ensures data integrity
  • Wide operating temperature range allows usage in various environments

Disadvantages

  • Relatively higher cost compared to other memory technologies
  • Limited scalability beyond the specified capacity
  • Requires proper cooling to prevent overheating

Working Principles

The AS4C64M16D3LA-12BINTR is based on the DDR3L SDRAM technology. It stores data in a matrix of capacitors, where each capacitor represents a memory cell. The data is stored as electrical charges within these capacitors. To read or write data, the memory controller sends commands and addresses to the memory module, which then performs the necessary operations.

Detailed Application Field Plans

The AS4C64M16D3LA-12BINTR is widely used in various electronic devices and systems, including: - Personal computers - Laptops and notebooks - Servers and data centers - Networking equipment - Industrial automation systems - Medical devices - Automotive electronics

Detailed and Complete Alternative Models

  • AS4C64M16D3LA-12BCNTR
  • AS4C64M16D3LA-12BCINTR
  • AS4C64M16D3LA-12BCN
  • AS4C64M16D3LA-12BCIN
  • AS4C64M16D3LA-12BCN-T
  • AS4C64M16D3LA-12BCI-T

These alternative models offer similar specifications and functionality, providing options for different sourcing and compatibility requirements.

In conclusion, the AS4C64M16D3LA-12BINTR is a high-speed and high-density memory module belonging to the category of integrated circuits. Its characteristics include low power consumption, wide operating temperature range, and a BGA package. With its functional features, advantages, and detailed application field plans, it serves as a reliable memory solution for various electronic devices and systems.

Перечислите 10 распространенных вопросов и ответов, связанных с применением AS4C64M16D3LA-12BINTR в технических решениях.

  1. Question: What is the capacity of the AS4C64M16D3LA-12BINTR memory module?
    Answer: The AS4C64M16D3LA-12BINTR is a 64 Meg x 16 DDR3L SDRAM module, which means it has a capacity of 1 Gigabyte (GB).

  2. Question: What is the operating voltage range for this memory module?
    Answer: The AS4C64M16D3LA-12BINTR operates at a voltage range of 1.35V to 1.5V.

  3. Question: What is the clock frequency supported by this memory module?
    Answer: The AS4C64M16D3LA-12BINTR supports a clock frequency of up to 1200 MHz.

  4. Question: Can this memory module be used in laptops or desktop computers?
    Answer: Yes, the AS4C64M16D3LA-12BINTR can be used in both laptops and desktop computers, as long as they support DDR3L SDRAM.

  5. Question: Is this memory module compatible with other DDR3 modules?
    Answer: Yes, the AS4C64M16D3LA-12BINTR is compatible with other DDR3 modules, but it is important to ensure that the motherboard supports DDR3L SDRAM.

  6. Question: What is the CAS latency of this memory module?
    Answer: The AS4C64M16D3LA-12BINTR has a CAS latency of 12 cycles.

  7. Question: Can this memory module be overclocked?
    Answer: Overclocking capabilities depend on the specific motherboard and its BIOS settings. However, the AS4C64M16D3LA-12BINTR is not specifically designed for overclocking.

  8. Question: Is this memory module suitable for gaming applications?
    Answer: Yes, the AS4C64M16D3LA-12BINTR can be used in gaming applications, as long as the system requirements are met.

  9. Question: Can this memory module be used in server applications?
    Answer: Yes, the AS4C64M16D3LA-12BINTR can be used in server applications that require DDR3L SDRAM.

  10. Question: What is the form factor of this memory module?
    Answer: The AS4C64M16D3LA-12BINTR follows the Small Outline Dual In-Line Memory Module (SO-DIMM) form factor, commonly used in laptops and small form factor systems.