AS4C64M8D3-12BCN

Product Overview

Category

The AS4C64M8D3-12BCN belongs to the category of dynamic random-access memory (DRAM) chips.

Use

It is used as a primary storage component in various electronic devices such as computers, smartphones, and networking equipment.

Characteristics

• High-speed operation
• Low power consumption
• Compact package size
• Wide operating temperature range

Package

The AS4C64M8D3-12BCN is typically available in a small outline dual in-line memory module (SODIMM) package.

Essence

The essence of AS4C64M8D3-12BCN lies in its ability to provide fast and efficient data storage and retrieval for electronic devices.

Packaging/Quantity

It is commonly packaged in trays or reels and is available in varying quantities based on customer requirements.

Specifications

• Part Number: AS4C64M8D3-12BCN
• Memory Type: DDR3 SDRAM
• Capacity: 512 Megabytes
• Organization: 64M words × 8 bits × 8 banks
• Speed: 1200 MHz
• Voltage: 1.5V ± 0.075V
• Operating Temperature: -40°C to +85°C
• Package: 78-ball FBGA

Detailed Pin Configuration

The AS4C64M8D3-12BCN features a precise pin configuration that includes address pins, data input/output pins, control pins, and power supply pins. The pinout diagram provides a clear understanding of the connectivity and functionality of each pin.

Functional Features

• Fast data access and transfer rates
• Low standby power consumption
• On-die termination for improved signal integrity
• Auto refresh and self-refresh modes for power efficiency

Advantages and Disadvantages

Advantages

• High-speed operation enhances system performance
• Low power consumption prolongs battery life in portable devices
• Compact package size enables integration into space-constrained designs

Disadvantages

• Limited capacity compared to newer memory technologies
• May not be compatible with systems requiring higher memory densities

Working Principles

The AS4C64M8D3-12BCN operates based on the principles of storing and retrieving digital data using a matrix of capacitors. When a specific memory location is accessed, the stored charge in the corresponding capacitor is read or modified.

Detailed Application Field Plans

The AS4C64M8D3-12BCN is widely used in applications such as: - Laptop and desktop computers - Industrial control systems - Networking equipment - Automotive electronics - Medical devices

Detailed and Complete Alternative Models

• AS4C32M16SB-7TCN: 512 Megabytes DDR3 SDRAM
• AS4C128M16D3A-12BCN: 1 Gigabyte DDR3 SDRAM
• AS4C256M16D3A-12BCN: 2 Gigabytes DDR3 SDRAM

In conclusion, the AS4C64M8D3-12BCN serves as a reliable and efficient DRAM chip suitable for a wide range of electronic applications, offering high-speed operation, low power consumption, and compact packaging.

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