V18ZU3P is a versatile electronic component that belongs to the category of voltage suppressor diodes. This entry provides an in-depth overview of the product, including its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.
The detailed specifications of V18ZU3P include: - Peak Pulse Power: 400W - Peak Pulse Current: 10A - Clamping Voltage: 29.2V - Operating Temperature Range: -55°C to +175°C - Breakdown Voltage: 18V - Reverse Standoff Voltage: 15.3V
The V18ZU3P voltage suppressor diode has a standard DO-15 package with two leads. The pin configuration is as follows: - Pin 1: Anode - Pin 2: Cathode
V18ZU3P operates by diverting excessive voltage away from sensitive components when a transient event occurs. When the voltage exceeds the breakdown voltage, the diode conducts, effectively clamping the voltage to a safe level and protecting the circuit.
V18ZU3P finds extensive use in various electronic applications, including: - Power supplies - Communication equipment - Automotive electronics - Industrial control systems - Consumer electronics
Some alternative models to V18ZU3P include: - V5.0ZU3P: 5V breakdown voltage variant - V12ZU3P: 12V breakdown voltage variant - V24ZU3P: 24V breakdown voltage variant - V36ZU3P: 36V breakdown voltage variant
In conclusion, V18ZU3P is a crucial component in electronic circuits, providing essential transient voltage suppression capabilities. Its specifications, functional features, and application versatility make it a valuable asset in various industries.
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What is V18ZU3P?
What are the key features of V18ZU3P?
Can V18ZU3P be used for bonding metal surfaces?
Is V18ZU3P suitable for outdoor applications?
What is the curing time for V18ZU3P?
Can V18ZU3P be used for bonding plastics?
Does V18ZU3P require special surface preparation before application?
Is V18ZU3P resistant to solvents and chemicals?
What temperature range can V18ZU3P withstand?
Is V18ZU3P suitable for structural bonding applications?