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MT29F64G08CBABBWP-12:B

MT29F64G08CBABBWP-12:B

Product Overview

Category

The MT29F64G08CBABBWP-12:B belongs to the category of NAND flash memory chips.

Use

This product is primarily used for data storage in various electronic devices such as smartphones, tablets, digital cameras, and solid-state drives (SSDs).

Characteristics

  • High storage capacity: The MT29F64G08CBABBWP-12:B offers a storage capacity of 64 gigabytes (GB), allowing for ample data storage.
  • Fast data transfer rate: With a high-speed interface, this NAND flash memory chip enables quick data read and write operations.
  • Reliable performance: The product is designed to provide reliable and consistent performance, ensuring data integrity.
  • Low power consumption: The MT29F64G08CBABBWP-12:B is energy-efficient, consuming minimal power during operation.
  • Compact package: It comes in a small form factor, making it suitable for integration into compact electronic devices.
  • Robust packaging: The chip is enclosed in a protective package that shields it from external factors such as moisture and physical damage.

Specifications

  • Model: MT29F64G08CBABBWP-12:B
  • Storage Capacity: 64 GB
  • Interface: NAND Flash
  • Operating Voltage: 3.3V
  • Data Transfer Rate: Up to 400 megabits per second (Mbps)
  • Package Type: Ball Grid Array (BGA)
  • Package Dimensions: 14mm x 18mm
  • Temperature Range: -40°C to +85°C

Pin Configuration

The detailed pin configuration of the MT29F64G08CBABBWP-12:B chip is as follows:

  1. VCC
  2. GND
  3. A0
  4. A1
  5. A2
  6. A3
  7. A4
  8. A5
  9. A6
  10. A7
  11. A8
  12. A9
  13. A10
  14. A11
  15. A12
  16. A13
  17. A14
  18. A15
  19. A16
  20. A17
  21. A18
  22. A19
  23. A20
  24. A21
  25. A22
  26. A23
  27. A24
  28. A25
  29. A26
  30. A27
  31. A28
  32. A29
  33. A30
  34. A31
  35. CLE
  36. ALE
  37. RE#
  38. WE#
  39. WP#
  40. R/B#
  41. CE#
  42. DQ0
  43. DQ1
  44. DQ2
  45. DQ3
  46. DQ4
  47. DQ5
  48. DQ6
  49. DQ7

Functional Features

  • Page Program: The chip supports fast and efficient page programming, allowing for quick data storage.
  • Block Erase: It provides the capability to erase large blocks of data simultaneously, enhancing efficiency.
  • Read and Write Operations: The MT29F64G08CBABBWP-12:B enables high-speed read and write operations, facilitating seamless data access.
  • Error Correction Code (ECC): This feature ensures data integrity by detecting and correcting errors during data transfer.

Advantages

  • High storage capacity meets the demands of modern electronic devices.
  • Fast data transfer rate enhances overall system performance.
  • Reliable performance ensures data integrity and longevity.
  • Low power consumption prolongs battery life in portable devices.
  • Compact package allows for easy integration into various electronic devices.
  • Robust packaging protects the chip from external factors, ensuring durability.

Disadvantages

  • The high storage capacity may result in a higher cost compared to lower-capacity alternatives.
  • Limited compatibility with certain older devices that do not support NAND flash memory.

Working Principles

The MT29F64G08CBABBWP-12:B operates based on the principles of NAND flash memory technology. It utilizes a grid-like structure of memory cells that store data in a non-volatile manner. When data is written, electrical charges are stored within the memory cells, and these charges can be read back later. The chip employs various algorithms and error correction techniques to ensure reliable data storage and retrieval.

Application Field Plans

The MT29F64G08CBABBWP-12:B is widely used in the following application fields: 1. Smartphones and tablets: Provides ample storage for apps, media files, and user data. 2. Digital cameras: Enables high-capacity storage for photos and videos. 3. Solid-state drives (SSDs): Used as primary storage in SSDs, offering fast and reliable data access.

Alternative Models

For those seeking alternative options, the following NAND

Перечислите 10 распространенных вопросов и ответов, связанных с применением MT29F64G08CBABBWP-12:B в технических решениях.

  1. Question: What is the capacity of the MT29F64G08CBABBWP-12:B memory chip?
    Answer: The MT29F64G08CBABBWP-12:B has a capacity of 64 gigabits (8 gigabytes).

  2. Question: What is the operating voltage range for this memory chip?
    Answer: The operating voltage range for the MT29F64G08CBABBWP-12:B is typically between 2.7V and 3.6V.

  3. Question: What is the maximum clock frequency supported by this memory chip?
    Answer: The MT29F64G08CBABBWP-12:B supports a maximum clock frequency of 100 MHz.

  4. Question: Does this memory chip support random access or sequential access?
    Answer: The MT29F64G08CBABBWP-12:B supports random access, allowing data to be read from or written to any location within the memory.

  5. Question: What is the page size of this memory chip?
    Answer: The MT29F64G08CBABBWP-12:B has a page size of 2,112 bytes.

  6. Question: Can this memory chip be used in industrial applications with extended temperature ranges?
    Answer: Yes, the MT29F64G08CBABBWP-12:B is designed to operate in industrial temperature ranges, typically between -40°C and +85°C.

  7. Question: Is this memory chip compatible with standard NAND flash interfaces?
    Answer: Yes, the MT29F64G08CBABBWP-12:B is compatible with standard NAND flash interfaces such as ONFI (Open NAND Flash Interface) and Toggle Mode.

  8. Question: What is the typical endurance rating for this memory chip?
    Answer: The MT29F64G08CBABBWP-12:B has a typical endurance rating of 3,000 program/erase cycles per block.

  9. Question: Does this memory chip support hardware data protection features?
    Answer: Yes, the MT29F64G08CBABBWP-12:B supports hardware data protection features such as ECC (Error Correction Code) and bad block management.

  10. Question: Can this memory chip be used in automotive applications?
    Answer: Yes, the MT29F64G08CBABBWP-12:B is designed to meet the requirements of automotive applications, including AEC-Q100 qualification.